Dicing saw

The Loadpoint MicroAce Series 3 is an ultra-high – precision, high speed cutting and scribing machine.

  • A wide range of materials can be cut including Silicon, Ferrite, Glass, Germanium and PZT up to 5 inch in diameter.
  • Wafer size: 2" to 5"
  • An air bearing work table with feed rate from 0.1 mm/sec upwards
  • DC servo motor with X and Y slideways accurate to within 2 microns for flatness and straightness.
  • Programmable Cutting speed from 3000 to 40000 rpm
  • Ability to precise align the work piece and the cut

Tool Specs

Manufacturer Loadpoint
Model MicroAce Series 3
Typical Application Dicing silicon, glass, and other materials
Location 6072
Related Documents

Standard Operating Procedure

Training Contact Mohamad Rezaei - rezaei@4dlabs.ca