Sample holder for one 4” wafer, wafer fragments or diced wafers

 - Thermal, photocurable nanoimprinting and embossing using an air cushion press (ACP) system

 - Ultra-uniform, low lateral stress, and low damage to the mold and substrate

 - Embossing pressure up to 500psi

 - Maximum Temperature of 250°C with heating Rate of 300°C/min and cooling Rate of 150°C/min

 - Mercury UV lamp for the exposure of UV-curable resist

Tool Specs

Tool Status Up
Manufacturer Heidelberg
Model DWL 66FS
Typical Application Photomask fabrication
Location 6060.9
Related Documents Standard Operating Procedure
Mask Writing Services
Mask Order Form
Training Contact Mohamad Rezaei -