RIE 2 - fluorine

  • Anisotropic etching of SiO2, Si3N4, and Si with CF4, CHF3, SF6, and O2
  • Resist stripping or ashing with O2
  • Endpoint detection via spectrometer 
  • Processing for small pieces, 50 and 100 mm wafers

Tool Specs

Manufacturer Sentech
Model Etchlab 2000
Typical Application Si, SiO2, and Si3N4 etching
Location 6060.6
Related Documents

Standard Operating Procedure

Training Contact Hadi Esmaeilsabzali - hesmaeil@sfu.ca