Wafer bonder

The AML-AWB aligner wafer bonder platform can perform in-situ aligned bonding of two flat substrates using the following bonding methods: anodic, glass frit, adhesive, thermo-compression, eutectic, solder and direct (low T “RAD” activated)

• In-situ visible and IR alignment with 1 micron accuracy

• Ultimate vacuum: 5 x 10-6 mbar

• Application of high voltages up to 2.5 kV

• Max 560°C for tungsten upper and lower platens, max 450°C for graphite upper platen (for glass bonding)

• Wafer size: 4" and 6"

• Forced nitrogen cooling optionWedge-wedge and ball-wedge bonding on the same machine